Moulding and Encapsulation

Protection that lasts under demanding conditions

Electronics operating in harsh environments require protection that remains effective over time. Fosstech has long experience with molding and encapsulation of components used in applications where water exposure, pressure, temperature variation, and corrosion are critical factors.

Molding and encapsulation at Fosstech are used to protect internal components from environmental and mechanical damage, not as a generic coating process. Solutions are developed to match how products are used in practice, and it is not uncommon for Fosstech to take over projects where previous solutions have failed in operation.

What we deliver

Fosstech provides molding and encapsulation solutions for a wide range of components and assemblies.

Typical applications include:

• Transducers, sensors, and electronics
• Mechanical components and assemblies
• Connectors and cable transitions

Material selection is based on the specific application and operating environment. Fosstech works with polyurethane, epoxy, and silicone systems, selected according to protection requirements, mechanical behaviour, and long-term exposure conditions.

Production is carried out with controlled processes to ensure consistent results. Dedicated tooling and customised molding processes are developed when required to meet project-specific needs.